The Application and Research Trends of Thermal Conductive Wave Absorbing Materials

With the development of electronic technology, the new generation of electronic components, from consumer electronics such as mobile phones and tablet computers to 5G communication RFFE/antenna modules, MIMO, wifi6, radar, and optical communication Optical module, have higher data transmission rates, higher power densities, and higher transmission frequency bands. In addition, electronic devices are required to have more functional modules while maintaining the existing size or even shrinking the size, This causes electronic devices to generate a large amount of waste heat during operation. These residual heat can increase the temperature of electronic equipment, cause a decrease in equipment performance stability, and even cause damage to the entire system. In severe cases, it can cause equipment fires and other accidents. At the same time, if the heat dissipation is not in place, it can greatly reduce the service life of electronic equipment. The use of high thermal conductivity functional materials can effectively evacuate excess heat and meet the needs of equipment for thermal management, which is very necessary for high power systems. At the same time, with the increase in power density of electronic components, the electromagnetic wave radiation interference caused by it has also received increasing attention. In order to improve the equipment's ability to resist electromagnetic interference, electronic packaging materials also need to have certain electromagnetic wave absorption performance to protect the normal operation of electronic components. EMI solutions may generate thermal issues, and vice versa. Therefore, it is difficult to solve EMI or heat dissipation problems alone, and solving these two problems simultaneously is increasingly becoming a problem that engineers must face, especially when both need to be balanced. Thermal conductive and absorbing materials have emerged.
More and more applications need higher thermal conductivity, such as more than 6W/m · K, wider wave absorption frequency band (100M~6GHz), and higher requirements for the morphology of thermal conductive wave absorbing materials, such as non-conductive and resilient thermal conductive gaskets based on the above high thermal conductivity and wide wave absorption frequency band, high flow rate two-component thermal conductive gel, and so on. Thermal conductive and absorbing materials can be directly applied between radiator components and metal shells, effectively exporting thermal energy, while possessing electromagnetic shielding and electromagnetic clutter absorption performance, providing a good solution for the thermal and electromagnetic shielding of electronic communication products. Thermal conductive absorbing materials are mainly used in products such as communication equipment, network equipment, and TV modules.Generally speaking, the thermal conductivity, conductivity, and absorption performance of polymer materials are generally low, which limits their further application in high-performance electronic systems. Polymer composite materials are widely used in the field of electronic packaging due to their high performance, corrosion resistance, lightweight, and low production cost. In the current industrial production practice, in order to solve the above problems, it is a simple and direct solution to add high-performance fillers such as Boron nitride, aluminum nitride, aluminum oxide, Graphene, carbon fiber, carbonyl iron powder, ferrite, MXene, etc. into the polymer matrix to prepare composite materials. This processing method requires a high filler content to improve the functionality of the material. However, excessive filler content can significantly reduce the mechanical properties of the prepared composite material, affecting its practical application. Therefore, the research focus of thermal conductive and wave absorbing polymer composites is to select appropriate thermal conductive and wave absorbing fillers, optimize the matching ratio, surface treatment and preparation process of the two functional fillers at the same time, and solve the problem that polymer can maintain excellent mechanical properties and anti-aging properties under high filling, and gel products can meet high functionality while taking into account the high extrusion rate of gel products The difficulty of easy dispensing process and other related issues will be the research and development trend of this type of material in the future, ultimately achieving the comprehensive optimal results of thermal conductivity and absorption performance.

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